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Smarter thermal management for electronics: Igloo demonstrator
The Igloo demonstrator showcases a new approach to passive thermal management using advanced thermally conductive (TC) materials. By replacing bulky aluminum heat sinks and messy thermal interface materials (TIMs), this over molded solution offers a lighter, simpler, and more effective way to cool electronics.
Story · July 18, 2025
The Material Effect
Smart Surfaces: Revolutionizing functional integration that enhances user experience across light, sound, touch, and vibration while solving critical thermal challenges. Solutions that enable sleeker designs with capabilities for AI-driven miniaturized electronics. Transform ordinary products into compelling innovations that distinguish themselves.
The Igloo solution: TC over molding
Igloo's innovative over molding solution injects thermally conductive material directly over the circuit board. By eliminating the need for separate heat sinks, adhesives, and fans, it forms a slim, thermally efficient layer that cools the entire board—not just the hot spots. The result? A lightweight, compact, and more durable design that also provides protection against moisture, dust, and vibration.
Proven performance
The Igloo demonstrator uses a Raspberry Pi CM4 over molded with Makrolon® TC210, replacing air with a thermally conductive material. It’s tested against two setups: one with an aluminum heat sink and TIM, and another with no cooling. Under load, the over molded board maintains lower temperatures and sustained performance, while the other two reach 85°C and throttle back power input, in order to keep the chips from overheating. Despite lower conductivity than aluminum, the TC material offers better passive cooling due to full-surface coverage and higher emissivity.
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The Igloo demonstrator showcases a practical solution for thermal management, replacing traditional heat sinks and TIMs with thermally conductive over molding. This approach simplifies design, reduces component weight, and eliminates the need for complex assembly processes. The result is a more efficient thermal solution that maintains stable processor performance without the need for active cooling systems.